However, despite the thorough understanding of lead-free PCB assembly, it should be performed by experts for perfection. This is important to ensure that the final product will not suffer from static charges during transportation. Physical and functional testing is performed prior to packaging.įor the packaging of lead-free PCBs, it is very important to use anti-electrostatic discharge bags. Visual inspection is followed by AOI and X-ray inspection. The solder joints are tested in this step. The PCBs are tested under IPC-600D standards. This helps fix the components at their position. Further, the boards are cooled at room temperature to solidify the melted solder paste. Therefore, the PCBs are placed inside a reflow oven, where the solder paste melts. The RoHS compatible PCBs are required to be heated at high temperature to evenly melt the solder paste. Regardless of the type of process, THT or SMT, the soldering must be lead-free.
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Lead-free through-hole or manual soldering is performed in this stage. The machine or operator picks the labeled component and places it to the designated location.
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This is a pick and place operation but the components used are required to be confirmed and labeled in the BOM verification stage. The component placement can be done manually or by using automated machinery. Once the solder paste is applied, the components are mounted on the board. Generally lead-free solder paste material is SAC305. Then the lead-free solder paste is applied. In this step, the lead-free stencil from the profiling stage is placed on the board.
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Lead-free PCB assembly means PCB assembly that uses no lead during any phase of manufacturing.
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